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I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof.
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.
FIG. 4 a rear elevational view thereof.
FIG. 5a right side view thereof.
FIG. 6 a cross-sectional view taken along line VI--VI in FIG. 2.
FIG. 7 a top plan view thereof; and,
FIG. 8 a bottom plan view thereof.
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Feb 05 1998 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Mar 18 1998 | SHIMAZU, TOMOHISA | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009126 | /0630 |
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