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The ornamental design for semiconductor wafer testing apparatus, as shown and described. |
FIG. 1 is a top, front and right side perspective view of a semiconductor wafer testing apparatus showing my new design;
FIG. 2 is a top plan view;
FIG. 3 is a front elevational view;
FIG. 4 is a left side elevational view;
FIG. 5 is a right side elevational view;
FIG. 6 is a rear elevational view; and,
FIG. 7 is a bottom plan view thereof.
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Apr 07 1993 | Tokyo Electron Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Apr 07 1993 | Tokyo Electron Yamanashi Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Jun 03 1993 | TAKAO, ITARU | Tokyo Electron Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006742 | /0474 | |
Jun 03 1993 | TAKAO, ITARU | Tokyo Electron Yamanashi Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006742 | /0474 | |
Mar 24 2001 | Tokyo Electron Yamanashi Kabushiki Kaisha | TOKYO ELELCTRON KABUSHIKI KAISHA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011663 | /0368 |
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