The ornamental design for a semiconductorsubstratetransfer apparatus, as shown and described.
FIG. 1 is a front, top, and right side perspective view of a semiconductor substrate transfer apparatus according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2.
The broken lines illustrate portions of the semiconductor substrate transfer apparatus that form no part of the claimed design. The hatching shown in FIG. 8 represents unclaimed subject matter and forms no part of the claimed design.