FIG. 1 is a front and upper right perspective view of a semiconductor
package showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a side elevational view thereof; and,
FIG. 4 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 24 1992 | OWENS, NORMAN L | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 006345 | /0368 |
pdf |
Nov 24 1992 | OLSON, TIMOTHY L | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 006345 | /0368 |
pdf |
Dec 03 1992 | | Motorola, Inc. | (assignment on the face of the patent) | | / |
Apr 04 2004 | Motorola, Inc | Freescale Semiconductor, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015698 | /0657 |
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Dec 01 2006 | Freescale Semiconductor, Inc | CITIBANK, N A AS COLLATERAL AGENT | SECURITY AGREEMENT | 018855 | /0129 |
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Dec 01 2006 | FREESCALE ACQUISITION CORPORATION | CITIBANK, N A AS COLLATERAL AGENT | SECURITY AGREEMENT | 018855 | /0129 |
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Dec 01 2006 | FREESCALE ACQUISITION HOLDINGS CORP | CITIBANK, N A AS COLLATERAL AGENT | SECURITY AGREEMENT | 018855 | /0129 |
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Dec 01 2006 | FREESCALE HOLDINGS BERMUDA III, LTD | CITIBANK, N A AS COLLATERAL AGENT | SECURITY AGREEMENT | 018855 | /0129 |
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Dec 07 2015 | CITIBANK, N A , AS COLLATERAL AGENT | Freescale Semiconductor, Inc | PATENT RELEASE | 037354 | /0225 |
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