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Patent
   D345731
Priority
Dec 03 1992
Filed
Dec 03 1992
Issued
Apr 05 1994
Expiry
Apr 05 2008
Inventors
Olson, Tim…
Assg.orig
Motorola, …
Assg.curr
Freescale …
Entity
unknown
Referenced by
44
References
5
Maint.:
n/a
The ornamental design for a semiconductor package, as shown and described.

FIG. 1 is a front and upper right perspective view of a semiconductor package showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is a bottom plan view thereof.
INVENTORS:

Olson, Timothy L., Owens, Norman L.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
10256385, Oct 31 2007 CREELED, INC Light emitting die (LED) packages and related methods
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D396211, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396212, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396213, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D397092, Jan 03 1997 Fujitsu Limited Integrated circuit package
D416236, Sep 02 1998 SII CRYSTAL TECHNOLOGY INC Integrated circuit package
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D458234, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459316, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459317, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D460744, Feb 15 2001 Mitsubishi Denki Kabushiki Kaishi Semiconductor device
D460951, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D461171, Feb 15 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D465773, Aug 31 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D466873, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D472528, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D522978, Jun 25 2004 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Information storage semiconductor element
D525214, Jun 25 2004 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Information storage semiconductor element
D594827, Dec 07 2006 CREE LED, INC Lamp package
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D732487, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D732488, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D738834, Jul 29 2014 Driver circuit integrated LED module
D758329, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D901405, Mar 28 2017 Rohm Co., Ltd. Semiconductor device
D902877, Jun 12 2018 Rohm Co., Ltd. Packaged semiconductor module
D914621, May 14 2019 Rohm Co., Ltd. Packaged semiconductor module
D920264, Nov 27 2019 The Noco Company Semiconductor device
D932452, Nov 27 2019 The Noco Company Semiconductor device
D934187, Jan 21 2020 GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D937231, Apr 06 2020 WOLFSPEED, INC Power semiconductor package
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5109269, Jul 08 1991 Method and means for positioning surface mounted electronic components on a printed wiring board
D259560, Jul 28 1978 Hitachi, Ltd. Semiconductor
D260986, Aug 25 1978 Hitachi, Ltd. Semiconductor
D288922, Apr 19 1984 SGS-Thomson Microelectronics, Inc Zero power random access memory package
D318271, Jul 04 1987 IBIDEN CO , LTD Substrate for mounting semiconductors
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 24 1992OWENS, NORMAN L Motorola, IncASSIGNMENT OF ASSIGNORS INTEREST 0063450368 pdf
Nov 24 1992OLSON, TIMOTHY LMotorola, IncASSIGNMENT OF ASSIGNORS INTEREST 0063450368 pdf
Dec 03 1992Motorola, Inc.(assignment on the face of the patent)
Apr 04 2004Motorola, IncFreescale Semiconductor, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156980657 pdf
Dec 01 2006Freescale Semiconductor, IncCITIBANK, N A AS COLLATERAL AGENTSECURITY AGREEMENT0188550129 pdf
Dec 01 2006FREESCALE ACQUISITION CORPORATIONCITIBANK, N A AS COLLATERAL AGENTSECURITY AGREEMENT0188550129 pdf
Dec 01 2006FREESCALE ACQUISITION HOLDINGS CORP CITIBANK, N A AS COLLATERAL AGENTSECURITY AGREEMENT0188550129 pdf
Dec 01 2006FREESCALE HOLDINGS BERMUDA III, LTD CITIBANK, N A AS COLLATERAL AGENTSECURITY AGREEMENT0188550129 pdf
Dec 07 2015CITIBANK, N A , AS COLLATERAL AGENTFreescale Semiconductor, IncPATENT RELEASE0373540225 pdf
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