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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof, the rear elevational view is omitted as that is the same image to the front elevational view thereof;
FIG. 4 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross-sectional view thereof, taken along line 7--7 of FIG. 4, with the internal system omitted.
Tokunaga, Muneharu, Matsuura, Tetsuya, Fukumoto, Takakazu
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 04 2001 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
| Jan 07 2002 | FUKUMOTO, TAKAKAZU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012515 | /0528 | |
| Jan 07 2002 | TOKUNAGA, MUNEHARU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012515 | /0528 | |
| Jan 07 2002 | MATSUURA, TETSUYA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012515 | /0528 |
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