Semiconductor package

Abstract

Description

FIG. 1 is a perspective view showing our design;

FIG. 2 is a left-hand side view thereof, the right-hand side view being a mirror image thereof;

FIG. 3 is a front view thereof, the rear view being identical thereto;

FIG. 4 is a sectional view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a semiconductor package, as shown and described.