Patent
   D475981
Priority
Mar 29 2002
Filed
Aug 16 2002
Issued
Jun 17 2003
Expiry
Jun 17 2017
Assg.orig
Entity
unknown
23
11
n/a
The ornamental design for an integrated circuits substrate, as shown and described.

FIG. 1 is a front, top and right side perspective view of an integrated circuits substrate, showing my new design;

FIG. 2 is a front elevational view thereof, the rear elevational view is omitted as that is symmetrical to the front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7--7 of FIG. 2, with the internal system omitted.

The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Michii, Kazunari

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 16 2002Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Sep 30 2002MICHII, KAZUNARIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134230815 pdf
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