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Patent
D259783
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Priority
Aug 25 1978
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Filed
Feb 26 1979
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Issued
Jul 07 1981
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Expiry
Jul 07 1995
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Assg.orig
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Entity
unknown
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22
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3
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n/a
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The ornamental design for a semiconductor, as shown.
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FIG. 1 is a right side, top and front perspective view of a semiconductor
showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof.
Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo
| Patent |
Priority |
Assignee |
Title |
| D432096, |
Nov 24 1999 |
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| D432097, |
Nov 20 1999 |
Samsung Electronics Co., Ltd. |
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| D658600, |
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| D658601, |
Jun 15 2010 |
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| D658602, |
Jun 15 2010 |
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Light emitting diode module |
| D658604, |
Jun 15 2010 |
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| D658605, |
Jun 15 2010 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
| D702689, |
Aug 17 2012 |
KINGSTON DIGITAL, INC. |
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| D702690, |
Oct 17 2012 |
KINGSTON DIGITAL, INC. |
Memory module |
| D796459, |
Apr 11 2016 |
Rohm Co., Ltd. |
Packaged semiconductor circuit module |
| D822629, |
Jan 26 2017 |
Kyocera Corporation |
Semiconductor package |
| D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
| D832228, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
| D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D853343, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D904325, |
Mar 20 2019 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
| D934187, |
Jan 21 2020 |
GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD |
Integrated circuit package |
| D937231, |
Apr 06 2020 |
WOLFSPEED, INC |
Power semiconductor package |
| D945384, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Semiconductor module |
| D969762, |
Apr 06 2020 |
WOLFSPEED, INC. |
Power semiconductor package |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a