Patent
   D796459
Priority
Apr 11 2016
Filed
Sep 28 2016
Issued
Sep 05 2017
Expiry
Sep 05 2032
Assg.orig
Entity
unknown
17
39
n/a
The ornamental design for a packaged semiconductor circuit module, as shown and described.

FIG. 1 is a perspective view of a packaged semiconductor circuit module showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Iwai, Katsuhiro

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 19 2016IWAI, KATSUHIROROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0398800548 pdf
Sep 28 2016Rohm Co., Ltd.(assignment on the face of the patent)
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