Patent
   D509810
Priority
Jul 30 2003
Filed
Jul 30 2003
Issued
Sep 20 2005
Expiry
Sep 20 2019
Assg.orig
Entity
unknown
3
7
n/a
The ornamental design for a molding structure of electric element, as shown and described herein.

FIG. 1 is a perspective view of a molding structure of electric element;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a top plane view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plane view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

Hsu, Han-Cheng

Patent Priority Assignee Title
D796459, Apr 11 2016 Rohm Co., Ltd. Packaged semiconductor circuit module
D832227, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
D832228, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
Patent Priority Assignee Title
5377077, Aug 01 1990 ENTORIAN TECHNOLOGIES L P Ultra high density integrated circuit packages method and apparatus
5637828, Oct 08 1993 Texas Instruments Inc. High density semiconductor package
5986336, Mar 22 1996 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a heat radiation plate
20040155323,
D357901, Sep 27 1993 Telefonaktiebolaget L M Ericsson Power supply unit
D402638, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
D449271, Jun 01 2000 AVANSYS POWER CO , LTD Power supply unit
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Jul 08 2003HSU, HAN-CHENGDELTA ELECTRONICS INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143620302 pdf
Jul 30 2003Delta Electronics Inc.(assignment on the face of the patent)
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