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The ornamental design for a molding structure of electric element, as shown and described herein.
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FIG. 1 is a perspective view of a molding structure of electric element;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a top plane view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plane view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Patent | Priority | Assignee | Title |
D796459, | Apr 11 2016 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
D832227, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
D832228, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
Patent | Priority | Assignee | Title |
5377077, | Aug 01 1990 | ENTORIAN TECHNOLOGIES L P | Ultra high density integrated circuit packages method and apparatus |
5637828, | Oct 08 1993 | Texas Instruments Inc. | High density semiconductor package |
5986336, | Mar 22 1996 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a heat radiation plate |
20040155323, | |||
D357901, | Sep 27 1993 | Telefonaktiebolaget L M Ericsson | Power supply unit |
D402638, | Apr 25 1997 | Micron Technology, Inc. | Temporary package for semiconductor dice |
D449271, | Jun 01 2000 | AVANSYS POWER CO , LTD | Power supply unit |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 08 2003 | HSU, HAN-CHENG | DELTA ELECTRONICS INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014362 | /0302 | |
Jul 30 2003 | Delta Electronics Inc. | (assignment on the face of the patent) | / |
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