Integrated circuit package

Abstract

Description

FIG. 1 is a front elevational view of our new integrated circuit package;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a perspective view thereof.

Claims

The ornamental design for an integrated circuit package, as shown.