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The ornamental design for a semiconductor, as shown and described.
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FIG. 1 is a bottom, front and right side perspective view of a semiconductor showing my new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a rear elevational view thereof,
FIG. 4 is a left side elevational view thereof,
FIG. 5 is a right side elevational view thereof,
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
D704670, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
D704671, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
D705184, | Jul 11 2013 | Fuji Electric Co., Ltd. | Semiconductor module |
D710317, | Jan 24 2013 | Fuji Electric Co., Inc. | Semiconductor device |
D710318, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
D710319, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
D717253, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717254, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717255, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717256, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719113, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719537, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D719926, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D721048, | Jun 17 2013 | FUJI ELECTRIC CO , LTD | Semiconductor module |
D721340, | Dec 21 2012 | Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD | Semiconductor module |
D748595, | Feb 03 2015 | Infineon Technologies AG | Power semiconductor module |
D754084, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D755741, | Feb 18 2015 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Power device package |
D755742, | Feb 18 2015 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Power device package |
D762597, | Aug 07 2014 | Infineon Technologies AG | Power semiconductor module |
D769834, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D770994, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D772182, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D777124, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D783550, | Sep 29 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D785577, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D805485, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D852765, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D853343, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D856947, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D859334, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D864135, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D877102, | Dec 28 2017 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
D888673, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D902877, | Jun 12 2018 | Rohm Co., Ltd. | Packaged semiconductor module |
D903613, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D906271, | Apr 13 2018 | ROHM CO , LTD | Semiconductor module |
D913978, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D914621, | May 14 2019 | Rohm Co., Ltd. | Packaged semiconductor module |
D920264, | Nov 27 2019 | The Noco Company | Semiconductor device |
D932452, | Nov 27 2019 | The Noco Company | Semiconductor device |
D971863, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D972516, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D978809, | Apr 13 2018 | Rohm Co., Ltd. | Semiconductor module |
D981356, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
Patent | Priority | Assignee | Title |
5557504, | Aug 31 1993 | SGS-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
20030042584, | |||
D288922, | Apr 19 1984 | SGS-Thomson Microelectronics, Inc | Zero power random access memory package |
D357462, | Sep 16 1993 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
D358806, | Sep 24 1993 | SGS-Thomson Microelectronics, Inc | Socketed integrated circuit package |
D359028, | Sep 02 1993 | SGS-Thomson Microelectronics, Inc | Socketed integrated circuit package |
D397092, | Jan 03 1997 | Fujitsu Limited | Integrated circuit package |
D401912, | Nov 27 1995 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D448739, | Sep 12 2000 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D505399, | Mar 14 2003 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D505400, | Mar 26 2004 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JP801093, | |||
JP946124, | |||
JP982886, | |||
TW106269, |
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