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The ornamental design for a semiconductor device, as shown and described. |
FIG. 1 is a top, front and right side perspective view of semiconductor device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a right side view thereo, the left side being a mirror image of the side shown.
Kawafuji, Hisashi, Mori, Satoshi, Noda, Sukehisa, Iwagami, Tooru, Takagi, Yoshio, Majumdar, Gorab
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 28 1996 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Sep 19 1997 | MORI, SATOSHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 | |
Sep 19 1997 | NODA, SUKEHISA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 | |
Sep 19 1997 | IWAGAMI, TOORU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 | |
Sep 19 1997 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 | |
Sep 20 1997 | MAJUMDAR, GORAB | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 | |
Sep 22 1997 | TAKAGI, YOSHIO | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008743 | /0684 |
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