Patent
   D772182
Priority
Apr 02 2014
Filed
Sep 29 2014
Issued
Nov 22 2016
Expiry
Nov 22 2030
Assg.orig
Entity
unknown
11
43
n/a
The ornamental design for a power semiconductor device, as shown and described.

FIG. 1 is a front, right and bottom perspective view of a power semiconductor device, showing our new design;

FIG. 2 is a rear, left and top perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.

Kawafuji, Hisashi, Kato, Masahiro, Nakagawa, Shinya, Hasegawa, Maki, Iwagami, Toru

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 04 2014HASEGAWA, MAKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0338390765 pdf
Sep 04 2014KATO, MASAHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0338390765 pdf
Sep 04 2014NAKAGAWA, SHINYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0338390765 pdf
Sep 04 2014KAWAFUJI, HISASHIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0338390765 pdf
Sep 04 2014IWAGAMI, TORUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0338390765 pdf
Sep 29 2014Mitsubishi Electric Corporation(assignment on the face of the patent)
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