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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a right side elevational view thereof; and,
FIG. 9 is a cross-sectional view thereof, taken along line 9--9 of FIG. 3, with the internal system omitted.
Kawafuji, Hisashi, Iwasaki, Mitsutaka, Iwagami, Toru
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 04 2002 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Apr 12 2002 | IWAGAMI, TORU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012853 | /0830 | |
Apr 12 2002 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012853 | /0830 | |
Apr 15 2002 | IWASAKI, MITSUTAKA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012853 | /0830 |
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