Patent
   D358806
Priority
Sep 24 1993
Filed
Sep 24 1993
Issued
May 30 1995
Expiry
May 30 2009
Assg.orig
Entity
unknown
38
7
n/a
The ornamental design for the socketed integrated circuit package, as shown and described.

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Siegel, Harry M., Kelappan, Krishnan, Hundt, Michael J.

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 24 1993SGS-Thomson Microelectronics, Inc.(assignment on the face of the patent)
Dec 13 1993SIEGEL, HARRY MICHAELSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068060269 pdf
Dec 13 1993HUNDT, MICHAEL J SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068060269 pdf
Dec 13 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068060269 pdf
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