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The ornamental design for the socketed integrated circuit package, as shown and described. |
FIG. 1 is a perspective view of the integrated circuit package;
FIG. 2 is a side elevation view of the integrated circuit package;
FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;
FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;
FIG. 5 is a top plan view of the integrated circuit package; and,
FIG. 6 is a bottom plan view of the integrated circuit package.
Siegel, Harry M., Kelappan, Krishnan, Hundt, Michael J.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 24 1993 | SGS-Thomson Microelectronics, Inc. | (assignment on the face of the patent) | / | |||
Dec 13 1993 | SIEGEL, HARRY MICHAEL | SGS-Thomson Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006806 | /0269 | |
Dec 13 1993 | HUNDT, MICHAEL J | SGS-Thomson Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006806 | /0269 | |
Dec 13 1993 | KELAPPAN, KRISHNAN | SGS-Thomson Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006806 | /0269 |
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