Patent
   D470824
Priority
Nov 30 2001
Filed
Mar 05 2002
Issued
Feb 25 2003
Expiry
Feb 25 2017
Assg.orig
Entity
unknown
10
9
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side elevational view thereof;

FIG. 8 is a right side elevational view thereof; and,

FIG. 9 is a cross-sectional view thereof, taken along line 9--9 of FIG. 3, with the internal system omitted.

Kawafuji, Hisashi, Iwasaki, Mitsutaka, Iwagami, Toru

Patent Priority Assignee Title
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D914621, May 14 2019 Rohm Co., Ltd. Packaged semiconductor module
D920264, Nov 27 2019 The Noco Company Semiconductor device
D932452, Nov 27 2019 The Noco Company Semiconductor device
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 05 2002Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Apr 12 2002IWAGAMI, TORUMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128530900 pdf
Apr 12 2002KAWAFUJI, HISASHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128530900 pdf
Apr 15 2002IWASAKI, MITSUTAKAMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128530900 pdf
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