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The ornamental design for a semiconductor device, as shown. |
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
Kawafuji, Hisashi, Toda, Hitoshi, Iwasaki, Mitsutaka
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 14 2001 | IWASAKI, MITSUTAKA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012042 | /0165 | |
Feb 14 2001 | TODA, HITOSHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012042 | /0165 | |
Feb 14 2001 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012042 | /0165 | |
Mar 09 2001 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / |
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