Patent
   D461171
Priority
Feb 15 2001
Filed
Jul 11 2001
Issued
Aug 06 2002
Expiry
Aug 06 2016
Assg.orig
Entity
unknown
8
23
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front, bottom and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken along line 8--8 of FIG. 5, with the internal system omitted.

Tokunaga, Muneharu, Matsuura, Tetsuya, Fukumoto, Takakazu

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Patent Priority Assignee Title
3706840,
4748538, Jul 08 1985 NEC Corporation Semiconductor module
4843695, Jul 16 1987 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Method of assembling tab bonded semiconductor chip package
5237201, Jul 21 1989 Kabushiki Kaisha Toshiba TAB type semiconductor device and method of manufacturing the same
5464054, Aug 09 1993 ANTARES CAPITAL LP, AS SUCCESSOR AGENT Spring clamp and heat sink assembly
6020625, Mar 27 1998 Renesas Electronics Corporation Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame
6093957, Apr 18 1997 LG Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
6300685, Aug 20 1998 OKI SEMICONDUCTOR CO , LTD Semiconductor package
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D416872, Nov 06 1997 ZF MICRO SOLUTIONS, INC Single component computer
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D432096, Nov 24 1999 Samsung Electronics Co., Ltd. Semiconductor module
D432097, Nov 20 1999 Samsung Electronics Co., Ltd. Semiconductor package
D448740, Nov 30 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP10173122,
JP2134890,
JP4276649,
JP6177501,
JP63114245,
JP6314885,
JP6334294,
JP6373694,
JP722727,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 11 2001Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Sep 05 2001FUKUMOTO, TAKAKAZUMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122100831 pdf
Sep 05 2001TOKUNAGA, MUNEHARUMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122100831 pdf
Sep 05 2001MATSUURA, TETSUYAMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122100831 pdf
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