|
The ornamental design for a semiconductor device, as shown and described.
|
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8--8 of FIG. 5, with the internal system omitted.
Tokunaga, Muneharu, Matsuura, Tetsuya, Fukumoto, Takakazu
Patent | Priority | Assignee | Title |
D706733, | Sep 16 2013 | AIO CORE CO , LTD | Signal conversion device |
D707193, | Sep 16 2013 | AIO CORE CO , LTD | Signal conversion device |
D822629, | Jan 26 2017 | Kyocera Corporation | Semiconductor package |
D904325, | Mar 20 2019 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
D923591, | Mar 15 2019 | TAMURA CORPORATION | Semiconductor driving circuit module |
D945384, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Semiconductor module |
RE45712, | Mar 18 2013 | AIO CORE CO , LTD | Signal conversion device |
RE45741, | Mar 18 2013 | AIO CORE CO , LTD | Signal conversion device |
Patent | Priority | Assignee | Title |
3706840, | |||
4748538, | Jul 08 1985 | NEC Corporation | Semiconductor module |
4843695, | Jul 16 1987 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Method of assembling tab bonded semiconductor chip package |
5237201, | Jul 21 1989 | Kabushiki Kaisha Toshiba | TAB type semiconductor device and method of manufacturing the same |
5464054, | Aug 09 1993 | ANTARES CAPITAL LP, AS SUCCESSOR AGENT | Spring clamp and heat sink assembly |
6020625, | Mar 27 1998 | Renesas Electronics Corporation | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
6093957, | Apr 18 1997 | LG Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
6300685, | Aug 20 1998 | OKI SEMICONDUCTOR CO , LTD | Semiconductor package |
D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
D416872, | Nov 06 1997 | ZF MICRO SOLUTIONS, INC | Single component computer |
D421969, | Sep 29 1998 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D432096, | Nov 24 1999 | Samsung Electronics Co., Ltd. | Semiconductor module |
D432097, | Nov 20 1999 | Samsung Electronics Co., Ltd. | Semiconductor package |
D448740, | Nov 30 2000 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JP10173122, | |||
JP2134890, | |||
JP4276649, | |||
JP6177501, | |||
JP63114245, | |||
JP6314885, | |||
JP6334294, | |||
JP6373694, | |||
JP722727, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 11 2001 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Sep 05 2001 | FUKUMOTO, TAKAKAZU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012210 | /0831 | |
Sep 05 2001 | TOKUNAGA, MUNEHARU | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012210 | /0831 | |
Sep 05 2001 | MATSUURA, TETSUYA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012210 | /0831 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |