Integrated circuit package

Abstract

Description

FIG. 1 is a front elevational view of an integrated circuit package showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

The broken lines shown on the integrated circuit package form no part of the claimed design.

Claims

The ornamental design for an integrated circuit package, as shown and described.