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Patent
D824866
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Priority
Sep 30 2016
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Filed
Mar 16 2017
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Issued
Aug 07 2018
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Expiry
Aug 07 2033
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Assg.orig
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Entity
unknown
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18
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5
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n/a
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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, bottom, and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, top, and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a right side view thereof, the left side view being a mirror image of FIG. 7.
Hirata, Shigeru, Kasuya, Yasumasa, Matsubara, Hiroaki
| Patent |
Priority |
Assignee |
Title |
| D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D853343, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D901405, |
Mar 28 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D902877, |
Jun 12 2018 |
Rohm Co., Ltd. |
Packaged semiconductor module |
| D904991, |
Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor element |
| D914621, |
May 14 2019 |
Rohm Co., Ltd. |
Packaged semiconductor module |
| D920264, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
| D932452, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
| D934187, |
Jan 21 2020 |
GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD |
Integrated circuit package |
| D937231, |
Apr 06 2020 |
WOLFSPEED, INC |
Power semiconductor package |
| D969762, |
Apr 06 2020 |
WOLFSPEED, INC. |
Power semiconductor package |
| D973029, |
Dec 15 2020 |
Rohm Co., Ltd. |
Semiconductor device |
| D974311, |
Jul 31 2020 |
Rohm Co., Ltd. |
Semiconductor module |
| D975666, |
Jul 31 2020 |
Rohm Co., Ltd. |
Semiconductor module |
| ER1297, |
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| ER266, |
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 16 2017 | MATSUBARA, HIROAKI | ROHM CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042034 | /0335 |
pdf |
| Feb 16 2017 | MATSUBARA, HIROAKI | ROHM CO , LTD | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 042034 FRAME 0335 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 046038 | /0852 |
pdf |
| Feb 17 2017 | KASUYA, YASUMASA | ROHM CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042034 | /0335 |
pdf |
| Feb 17 2017 | KASUYA, YASUMASA | ROHM CO , LTD | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 042034 FRAME 0335 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 046038 | /0852 |
pdf |
| Feb 21 2017 | HIRATA, SHIGERU | ROHM CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042034 | /0335 |
pdf |
| Feb 21 2017 | HIRATA, SHIGERU | ROHM CO , LTD | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 042034 FRAME 0335 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 046038 | /0852 |
pdf |
| Mar 16 2017 | | Rohm Co., Ltd. | (assignment on the face of the patent) | | / |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a