PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D937231
|
Priority
Apr 06 2020
|
Filed
Apr 06 2020
|
Issued
Nov 30 2021
|
Expiry
Nov 30 2036
|
|
Assg.orig
|
|
Entity
unknown
|
5
|
39
|
n/a
|
|
|
The ornamental design for a power semiconductor package, as shown and described.
|
FIG. 1 is a top perspective view of a power semiconductor package showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a front view thereof;
FIG. 6 is a rear view thereof;
FIG. 7 is a side view thereof; and,
FIG. 8 is an opposite side view thereof.
The broken lines shown in the drawings depict portions of the power semiconductor package that form no part of the claimed design.
Saxena, Kuldeep
Patent |
Priority |
Assignee |
Title |
10600744, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor device |
3340347, |
|
|
|
5798570, |
Jun 28 1996 |
Kabushiki Kaisha Gotoh Seisakusho |
Plastic molded semiconductor package with thermal dissipation means |
6093957, |
Apr 18 1997 |
LG Semicon Co., Ltd. |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
6238953, |
Jan 12 1999 |
Sony Corporation |
Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
6555899, |
Oct 15 1999 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Semiconductor package leadframe assembly and method of manufacture |
20170133315, |
|
|
|
D259559, |
Jul 28 1978 |
Hitachi, LTD |
Semiconductor |
D259560, |
Jul 28 1978 |
Hitachi, Ltd. |
Semiconductor |
D259782, |
Jul 28 1978 |
Hitachi, Ltd. |
Semiconductor |
D259783, |
Aug 25 1978 |
Hitachi, Ltd. |
Semiconductor |
D260091, |
Aug 25 1978 |
Hitachi, Ltd. |
Semiconductor |
D260986, |
Aug 25 1978 |
Hitachi, Ltd. |
Semiconductor |
D345731, |
Dec 03 1992 |
Freescale Semiconductor, Inc |
Semiconductor package |
D396846, |
Apr 16 1997 |
Panasonic Corporation |
Semiconductor device |
D396847, |
Oct 17 1996 |
Panasonic Corporation |
Semiconductor device |
D397092, |
Jan 03 1997 |
Fujitsu Limited |
Integrated circuit package |
D421421, |
Nov 19 1998 |
Honda Tsushin Kogyo Co., Ltd. |
Connector receptacle for IC card |
D432097, |
Nov 20 1999 |
Samsung Electronics Co., Ltd. |
Semiconductor package |
D444132, |
Aug 23 2000 |
Kabushiki Kaisha Toshiba |
Semiconductor element |
D466485, |
May 23 2001 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package |
D466873, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
D472528, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
D475028, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D475355, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D475982, |
Mar 11 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D476962, |
Mar 29 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D489338, |
Jul 28 2003 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Packaged semiconductor device |
D504874, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D508682, |
Feb 23 2004 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
D510728, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D796459, |
Apr 11 2016 |
Rohm Co., Ltd. |
Packaged semiconductor circuit module |
D824866, |
Sep 30 2016 |
Rohm Co., Ltd. |
Semiconductor device |
D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D832228, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D853343, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D874411, |
Apr 13 2008 |
ROHM CO , LTD |
Semiconductor module |
D900759, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D902877, |
Jun 12 2018 |
Rohm Co., Ltd. |
Packaged semiconductor module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a