|
PTO
Wrapper
PDF
|
|
Dossier
Espace
Google
|
|
|
|
Patent
D260986
|
|
Priority
Aug 25 1978
|
|
Filed
Feb 26 1979
|
|
Issued
Sep 29 1981
|
|
Expiry
Sep 29 1995
|
|
|
|
Assg.orig
|
|
|
|
Entity
unknown
|
|
10
|
|
3
|
|
n/a
|
|
|
|
The ornamental design for a semiconductor, as shown.
|
FIG. 1 is a right side, top and front perspective view of a semiconductor
showing our new design.
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof.
Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo
| Patent |
Priority |
Assignee |
Title |
| D345731, |
Dec 03 1992 |
Freescale Semiconductor, Inc |
Semiconductor package |
| D416872, |
Nov 06 1997 |
ZF MICRO SOLUTIONS, INC |
Single component computer |
| D796459, |
Apr 11 2016 |
Rohm Co., Ltd. |
Packaged semiconductor circuit module |
| D822629, |
Jan 26 2017 |
Kyocera Corporation |
Semiconductor package |
| D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
| D832228, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
| D904325, |
Mar 20 2019 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
| D937231, |
Apr 06 2020 |
WOLFSPEED, INC |
Power semiconductor package |
| D945384, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Semiconductor module |
| D969762, |
Apr 06 2020 |
WOLFSPEED, INC. |
Power semiconductor package |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a