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The ornamental design for a semiconductor, as shown and described. |
FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 8 is a bottom view thereof;
FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 10 is a bottom view thereof;
FIG. 11 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 12 is a bottom view thereof.
Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 08 1979 | OTSUKI, KEIZO | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
Jan 08 1979 | KOSAKA, HIDEKI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
Jan 08 1979 | MURAKAMI, GEN | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
Jan 08 1979 | MOCHIZUKI HIDETOSHI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
Jan 24 1979 | Hitachi, Ltd. | (assignment on the face of the patent) | / |
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