Patent
   D259560
Priority
Jul 28 1978
Filed
Jan 24 1979
Issued
Jun 16 1981
Expiry
Jun 16 1995
Assg.orig
Entity
unknown
16
3
n/a
The ornamental design for a semiconductor, as shown and described.

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 8 is a bottom view thereof;

FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 10 is a bottom view thereof;

FIG. 11 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 12 is a bottom view thereof.

Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo

Patent Priority Assignee Title
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D658601, Jun 15 2010 Toshiba Lighting & Technology Corporation Light emitting diode module
D658603, Jun 15 2010 Toshiba Lighting & Technology Corporation Light emitting diode module
D796459, Apr 11 2016 Rohm Co., Ltd. Packaged semiconductor circuit module
D822629, Jan 26 2017 Kyocera Corporation Semiconductor package
D832227, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
D832228, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D904325, Mar 20 2019 Sansha Electric Manufacturing Company, Limited Semiconductor module
D934187, Jan 21 2020 GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D937231, Apr 06 2020 WOLFSPEED, INC Power semiconductor package
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
Patent Priority Assignee Title
3208892,
3436451,
4012766, Aug 28 1973 Western Digital Corporation Semiconductor package and method of manufacture thereof
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 08 1979OTSUKI, KEIZOHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250605 pdf
Jan 08 1979KOSAKA, HIDEKIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250605 pdf
Jan 08 1979MURAKAMI, GENHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250605 pdf
Jan 08 1979MOCHIZUKI HIDETOSHIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250605 pdf
Jan 24 1979Hitachi, Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule