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The ornamental design for a semiconductor, as shown and described. |
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FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 8 is a bottom view thereof;
FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 10 is a bottom view thereof;
FIG. 11 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 12 is a bottom view thereof.
Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo
| Patent | Priority | Assignee | Title |
| D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
| D658601, | Jun 15 2010 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| D658603, | Jun 15 2010 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| D796459, | Apr 11 2016 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| D822629, | Jan 26 2017 | Kyocera Corporation | Semiconductor package |
| D832227, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
| D832228, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
| D852765, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
| D853343, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
| D859334, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
| D864135, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
| D904325, | Mar 20 2019 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| D934187, | Jan 21 2020 | GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD | Integrated circuit package |
| D937231, | Apr 06 2020 | WOLFSPEED, INC | Power semiconductor package |
| D945384, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Semiconductor module |
| D969762, | Apr 06 2020 | WOLFSPEED, INC. | Power semiconductor package |
| ER266, |
| Patent | Priority | Assignee | Title |
| 3208892, | |||
| 3436451, | |||
| 4012766, | Aug 28 1973 | Western Digital Corporation | Semiconductor package and method of manufacture thereof |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 08 1979 | OTSUKI, KEIZO | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
| Jan 08 1979 | KOSAKA, HIDEKI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
| Jan 08 1979 | MURAKAMI, GEN | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
| Jan 08 1979 | MOCHIZUKI HIDETOSHI | Hitachi, LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 003825 | /0605 | |
| Jan 24 1979 | Hitachi, Ltd. | (assignment on the face of the patent) | / |
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