Patent
   D259559
Priority
Jul 28 1978
Filed
Jan 24 1979
Issued
Jun 16 1981
Expiry
Jun 16 1995
Assg.orig
Entity
unknown
12
3
n/a
The ornamental design for a semiconductor, as shown.

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design.

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a bottom view thereof.

Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo

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D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
Patent Priority Assignee Title
3208892,
3436451,
4012766, Aug 28 1973 Western Digital Corporation Semiconductor package and method of manufacture thereof
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 08 1979OTSUKI, KEIZOHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250603 pdf
Jan 08 1979KOSAKA, HIDEKIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250603 pdf
Jan 08 1979MURKAMI, GENHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250603 pdf
Jan 24 1979Hitachi, Ltd.(assignment on the face of the patent)
Jan 28 1979MOCHIZUKI HIDETOSHIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250603 pdf
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