Semiconductor module

Abstract

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor module, showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof, the left side view being identical to FIG. 7;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5; and,

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5.

The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.

Claims

The ornamental design for a semiconductor module, as shown and described.