Patent
   D712853
Priority
Dec 21 2012
Filed
Jun 21 2013
Issued
Sep 09 2014
Expiry
Sep 09 2028
Assg.orig
Entity
unknown
35
22
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along line 8-8 of FIG. 5.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.

Nakamura, Hideyo

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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 21 2013Fuji Electric Co., Ltd.(assignment on the face of the patent)
Jun 21 2013NAKAMURA, HIDEYOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0307080581 pdf
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