Patent
   D877102
Priority
Dec 28 2017
Filed
Mar 28 2018
Issued
Mar 03 2020
Expiry
Mar 03 2035
Assg.orig
Entity
unknown
9
48
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a top perspective view of a semiconductor module, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a underside plan view thereof.

The broken lines in the Figures are for environmental purposes only and form no part of the claimed design.

Kamiyama, Yoshihiro

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 06 2018KAMIYAMA, YOSHIHIROSHINDENGEN ELECTRIC MANUFACTURING CO , LTD NUNC PRO TUNC ASSIGNMENT SEE DOCUMENT FOR DETAILS 0459940263 pdf
Mar 28 2018Shindengen Electric Manufacturing Co., Ltd.(assignment on the face of the patent)
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