Semiconductor module

Abstract

Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing my new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof, the left side view being a mirror image of FIG. 7;

FIG. 8 is a front, top and right side perspective view of a second embodiment of a semiconductor module showing my new design;

FIG. 9 is a rear, bottom and left side perspective view thereof;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a right side view thereof, the left side view being a mirror image of FIG. 14.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.