Patent
   D448739
Priority
Sep 12 2000
Filed
Mar 08 2001
Issued
Oct 02 2001
Expiry
Oct 02 2015
Assg.orig
Entity
unknown
44
5
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7--7 of FIG. 2, with the internal system omitted; and,

FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8--8 of FIG. 2, with the internal system omitted.

Kawafuji, Hisashi, Toda, Hitoshi, Iwasaki, Mitsutaka

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Patent Priority Assignee Title
5089929, Mar 08 1990 U S INTELCO NETWORKS, INC Retrofit integrated circuit terminal protection device
5221859, Feb 26 1990 Hitachi, Ltd. Lead frame for semiconductor device
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 14 2001IWASAKI, MITSUTAKAMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120520721 pdf
Feb 14 2001TODA, HITOSHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120520721 pdf
Feb 14 2001KAWAFUJI, HISASHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120520721 pdf
Mar 08 2001Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
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