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The ornamental design for a semiconductor device, as shown and described. |
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7--7 of FIG. 2, with the internal system omitted; and,
FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8--8 of FIG. 2, with the internal system omitted.
Kawafuji, Hisashi, Toda, Hitoshi, Iwasaki, Mitsutaka
Patent | Priority | Assignee | Title |
9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
D470825, | Dec 28 2001 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D505399, | Mar 14 2003 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D505400, | Mar 26 2004 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D539761, | Aug 22 2006 | Kabushiki Kaisha Toshiba | Semiconductor |
D548202, | Apr 17 2006 | Kabushiki Kaisha Toshiba | Semiconductor |
D548203, | Apr 17 2006 | Kabushiki Kaisha Toshiba | Semiconductor |
D554587, | Jul 19 2006 | Mitsumi Electric Co., Ltd. | Circuit module for protecting the battery |
D556687, | Jun 06 2006 | MITSUMI ELECTRIC CO , LTD | Circuit module for protecting the battery |
D694724, | Oct 03 2012 | HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD | Semiconductor device |
D699693, | Oct 03 2012 | FUJI ELECTRIC CO , LTD | Semiconductor device |
D703625, | Dec 06 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Power semiconductor module |
D717253, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717254, | Oct 11 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717255, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D717256, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719113, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D719926, | Sep 20 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Semiconductor device |
D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
D770994, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D772182, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D777124, | Apr 02 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D783550, | Sep 29 2014 | Mitsubishi Electric Corporation | Power semiconductor device |
D839220, | Feb 19 2013 | Sony Corporation | Semiconductor device |
D852765, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D853343, | Oct 19 2017 | Rohm Co., Ltd. | Semiconductor device |
D859334, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D864135, | Oct 26 2017 | Mitsubishi Electric Corporation | Semiconductor device |
D873226, | Apr 13 2018 | ROHM CO , LTD | Semiconductor module |
D874411, | Apr 13 2008 | ROHM CO , LTD | Semiconductor module |
D874412, | Apr 13 2018 | ROHM CO , LTD | Semiconductor module |
D877102, | Dec 28 2017 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
D888673, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D902877, | Jun 12 2018 | Rohm Co., Ltd. | Packaged semiconductor module |
D903613, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D906271, | Apr 13 2018 | ROHM CO , LTD | Semiconductor module |
D913978, | Jun 26 2018 | Rohm Co., Ltd. | Semiconductor module |
D914621, | May 14 2019 | Rohm Co., Ltd. | Packaged semiconductor module |
D920264, | Nov 27 2019 | The Noco Company | Semiconductor device |
D932452, | Nov 27 2019 | The Noco Company | Semiconductor device |
D971863, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D972516, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
D978809, | Apr 13 2018 | Rohm Co., Ltd. | Semiconductor module |
D981356, | Jan 28 2020 | Rohm Co., Ltd. | Semiconductor module |
Patent | Priority | Assignee | Title |
5089929, | Mar 08 1990 | U S INTELCO NETWORKS, INC | Retrofit integrated circuit terminal protection device |
5221859, | Feb 26 1990 | Hitachi, Ltd. | Lead frame for semiconductor device |
D401912, | Nov 27 1995 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D421969, | Sep 29 1998 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D428859, | Jan 28 1999 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 14 2001 | IWASAKI, MITSUTAKA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012052 | /0721 | |
Feb 14 2001 | TODA, HITOSHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012052 | /0721 | |
Feb 14 2001 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012052 | /0721 | |
Mar 08 2001 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / |
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