Patent
   D694724
Priority
Oct 03 2012
Filed
Dec 27 2012
Issued
Dec 03 2013
Expiry
Dec 03 2027
Assg.orig
Entity
unknown
0
33
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front view of a semiconductor device showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a partially enlarged view thereof taken along lines VII-VII in FIG. 2;

FIG. 8 is a partially enlarged view thereof taken along lines VIII-VIII in FIG. 4;

FIG. 9 is a partially enlarged view thereof taken along lines IX-IX in FIG. 5;

FIG. 10 is a front perspective view thereof; and,

FIG. 11 is a rear perspective view thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Soyano, Shin, Kikuchi, Masahiro, Otsuka, Hiroshi, Nishiyama, Kosuke, Nishiura, Akira, Fukazu, Tomohiro, Ichimura, Takeshi

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Dec 27 2012Honda Motor Co., Ltd.(assignment on the face of the patent)
Dec 27 2012Fuji Electric Co., Ltd.(assignment on the face of the patent)
Feb 15 2013NISHIURA, AKIRAFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0298920587 pdf
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