Patent
   D525215
Priority
Jan 27 2004
Filed
Jun 10 2005
Issued
Jul 18 2006
Expiry
Jul 18 2020
Assg.orig
Entity
unknown
11
7
n/a
The ornamental design for a base for a semiconductor carrier, as shown and described.

FIG. 1 is a top-front perspective view of a base for a semiconductor carrier of our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a right-end view thereof; and,

FIG. 7 is a left-end view thereof.

Matsuoka, Noriyuki, Hisaishi, Minoru, Suzuki, Takeyuki

Patent Priority Assignee Title
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D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
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Patent Priority Assignee Title
5451165, Jul 27 1994 Minnesota Mining and Manufacturing Company Temporary package for bare die test and burn-in
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 10 2005Yamaichi Electronics Co., Ltd.(assignment on the face of the patent)
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