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Patent
D748595
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Priority
Feb 03 2015
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Filed
Feb 03 2015
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Issued
Feb 02 2016
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Expiry
Feb 02 2030
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Assg.orig
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Entity
unknown
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47
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32
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n/a
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The ornamental design for a power semiconductor module, as shown and described.
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FIG. 1 is a top, side, perspective view of a power semiconductor module showing our new design;
FIG. 2 is another top, side, perspective view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is another side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is another side elevational view thereof.
All surfaces not shown form no part of the claimed design.
Borghoff, Georg, Bertalan, Andras, Hoehn, Alexander
Patent |
Priority |
Assignee |
Title |
D759604, |
Jun 17 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D761746, |
Nov 04 2014 |
Sumitomo Electric Industries, Ltd. |
Semiconductor module for power conversion |
D762185, |
Aug 21 2014 |
Infineon Technologies AG |
Power semiconductor module |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D766851, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D767516, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D772184, |
Dec 24 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D773412, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D773413, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D774479, |
Nov 28 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D775091, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D775593, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D776071, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D790491, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D798832, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D799439, |
May 31 2016 |
Rohm Co., Ltd. |
Power converting semiconductor module |
D810036, |
Nov 08 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D810706, |
Dec 24 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D814433, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D827591, |
Oct 31 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D827593, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D837752, |
Jan 31 2017 |
|
Heatsink |
D847103, |
Sep 07 2017 |
ROHM CO , LTD |
Power semiconductor module |
D847104, |
Sep 29 2017 |
ROHM CO , LTD |
Power semiconductor module |
D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D853342, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D853978, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864132, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D873227, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D875058, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D879729, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D884662, |
Jun 01 2018 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D903611, |
Mar 29 2019 |
Mitsubishi Electric Corporation |
Semiconductor device |
D904991, |
Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor element |
D911987, |
Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor element |
D916039, |
Mar 20 2020 |
Sansha Electric Manufacturing Co., Ltd. |
Semiconductor device |
D917402, |
Aug 22 2017 |
FOXCONN INTERCONNECT TECHNOLOGY LIMITED |
Protective cap |
D927437, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934188, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934189, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934190, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934822, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D962881, |
May 06 2019 |
Lam Research Corporation |
Semiconductor wafer processing apparatus |
D969761, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981354, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981355, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
Patent |
Priority |
Assignee |
Title |
5408128, |
Sep 15 1993 |
International Rectifier Corporation |
High power semiconductor device module with low thermal resistance and simplified manufacturing |
5410450, |
Dec 10 1991 |
Fuji Electric Co., Ltd. |
Internal wiring structure of a semiconductor device |
6078501, |
Dec 22 1997 |
Omnirel LLC |
Power semiconductor module |
6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
8526199, |
May 07 2010 |
Mitsubishi Electric Corporation |
Semiconductor device |
D364383, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364384, |
May 23 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364385, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
D441727, |
Oct 04 2000 |
Sony Corporation |
Semiconductor element |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D525215, |
Jan 27 2004 |
Yamaichi Electronics Co., Ltd. |
Base for a semiconductor carrier |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548202, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548203, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D587662, |
Dec 20 2007 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D589012, |
Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D606951, |
Nov 14 2008 |
Fuji Electric Device Technology Co, Ltd. |
Semiconductor device |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D689446, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D699693, |
Oct 03 2012 |
FUJI ELECTRIC CO , LTD |
Semiconductor device |
D703625, |
Dec 06 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Power semiconductor module |
D704670, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D704671, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D706232, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor device |
D710317, |
Jan 24 2013 |
Fuji Electric Co., Inc. |
Semiconductor device |
D710318, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D710319, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
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