Patent
   D917402
Priority
Aug 22 2017
Filed
Feb 08 2018
Issued
Apr 27 2021
Expiry
Apr 27 2036
Assg.orig
Entity
unknown
3
20
n/a
The ornamental design for a protective cap, as shown and described.

FIG. 1 is a perspective view of a Protective Cap showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plane view thereof; and,

FIG. 8 is a perspective view thereof, shown in use.

The broken line showing of related parts is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Wu, Heng-Kang, Peng, Fu-Jin

Patent Priority Assignee Title
D964948, Aug 02 2019 GUDENG PRECISION INDUSTRIAL CO., LTD. Upper cover for an ultraviolet light reticle transfer box
D964949, Aug 02 2019 GUDENG PRECISION INDUSTRIAL CO., LTD. Upper cover for an ultraviolet light reticle transfer box
ER1432,
Patent Priority Assignee Title
10103086, Dec 16 2016 ABLECOM TECHNOLOGY INC. Fixing frame for heat sink
5410450, Dec 10 1991 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
6282093, Jun 11 1999 Thomas & Betts International, Inc. LGA clamp mechanism
7190586, Mar 03 2004 Hewlett-Packard Development Company, L.P.; HEWLETT-PACKARD DEVELOPMENT COMPANY L P Heat sink retention assembly and related methods
7292447, Mar 22 2006 FU ZHUN PRECISION INDUSTRY SHENZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Back plate assembly for a board
7534114, Aug 20 2007 Hon Hai Precision Ind. Co., Ltd. Land grid array connector assembly with pick up cap
20160295714,
20200099170,
20200126889,
CN106848717,
200105,
D303951, Mar 27 1986 LASALLE BUSINESS CREDIT, INC Heat-sink cover for leadless electronic chip-carrier sockets
D438515, Sep 20 1999 Mitsubishi Denki Kabushiki Kaisha Portion of heat sink
D509482, Mar 06 2003 Datech Technology Co., Ltd. Heat sink cap
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D825498, Jul 17 2017 META PLATFORMS TECHNOLOGIES, LLC Heat sink assembly
D837753, Jun 27 2018 Advanced Thermal Solutions, Inc.; ADVANCED THERMAL SOLUTIONS, INC Heat sink clip
D853402, May 09 2018 I-Blason LLC Protective case for mobile device
D877513, Apr 27 2018 POV MOUNTING SYSTEMS, LLC Wallet money clip
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 01 2018WU, HENG-KANG FOXCONN INTERCONNECT TECHNOLOGY LIMITEDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0448760435 pdf
Feb 01 2018PENG, FU-JIN FOXCONN INTERCONNECT TECHNOLOGY LIMITEDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0448760435 pdf
Feb 08 2018FOXCONN INTERCONNECT TECHNOLOGY LIMITED(assignment on the face of the patent)
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