|
The ornamental design for a heat sink cap, as shown and described.
|
FIG. 1 is a perspective view of a heat sink cap, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
D672449, | Dec 29 2010 | Ceiling ventilating fan with light | |
D917402, | Aug 22 2017 | FOXCONN INTERCONNECT TECHNOLOGY LIMITED | Protective cap |
ER5136, |
Patent | Priority | Assignee | Title |
4679118, | Aug 07 1984 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
5081067, | Feb 10 1989 | Fujitsu Microelectronics Limited | Ceramic package type semiconductor device and method of assembling the same |
5295043, | Feb 03 1992 | Tandon Corporation | Clip-on heat sink and method of cooling a computer chip package |
5981310, | Jan 22 1998 | GLOBALFOUNDRIES Inc | Multi-chip heat-sink cap assembly |
6534859, | Apr 05 2002 | STATS CHIPPAC PTE LTE | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package |
6784113, | Sep 03 1998 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
20040070069, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 24 2003 | HUANG, HUNG-CHU | DATECH TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014037 | /0013 | |
May 02 2003 | Datech Technology Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |