Patent
   D509482
Priority
Mar 06 2003
Filed
May 02 2003
Issued
Sep 13 2005
Expiry
Sep 13 2019
Assg.orig
Entity
unknown
3
7
n/a
The ornamental design for a heat sink cap, as shown and described.

FIG. 1 is a perspective view of a heat sink cap, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Huang, Hung-Chu

Patent Priority Assignee Title
D672449, Dec 29 2010 Ceiling ventilating fan with light
D917402, Aug 22 2017 FOXCONN INTERCONNECT TECHNOLOGY LIMITED Protective cap
ER5136,
Patent Priority Assignee Title
4679118, Aug 07 1984 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
5081067, Feb 10 1989 Fujitsu Microelectronics Limited Ceramic package type semiconductor device and method of assembling the same
5295043, Feb 03 1992 Tandon Corporation Clip-on heat sink and method of cooling a computer chip package
5981310, Jan 22 1998 GLOBALFOUNDRIES Inc Multi-chip heat-sink cap assembly
6534859, Apr 05 2002 STATS CHIPPAC PTE LTE Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
6784113, Sep 03 1998 Micron Technology, Inc. Chip on board and heat sink attachment methods
20040070069,
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Feb 24 2003HUANG, HUNG-CHUDATECH TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0140370013 pdf
May 02 2003Datech Technology Co., Ltd.(assignment on the face of the patent)
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