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Patent
D825498
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Priority
Jul 17 2017
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Filed
Jul 17 2017
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Issued
Aug 14 2018
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Expiry
Aug 14 2033
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Assg.orig
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Entity
unknown
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2
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17
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n/a
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The ornamental design for a heat sink assembly, as shown and described.
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FIG. 1 is a perspective view of a heat sink assembly, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
Allin, Boyd Drew, Stellman, Jeffrey Taylor
Patent |
Priority |
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Oct 20 2012 |
Apple Inc |
Thermal device |
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Mar 22 2016 |
ASM IP Holding B.V. |
Substrate supporting arm for semiconductor manufacturing apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a