PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D785578
|
Priority
Mar 22 2016
|
Filed
Mar 22 2016
|
Issued
May 02 2017
|
Expiry
May 02 2032
|
|
Assg.orig
|
|
Entity
unknown
|
11
|
16
|
n/a
|
|
|
The ornamental design for a substrate supporting arm for a semiconductor manufacturing apparatus, as shown and described.
|
FIG. 1 is a perspective view of a substrate supporting arm for a semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Lee, Jeong Ho, Kim, Jong Su, Jang, Hyun Soo, Kim, Woo Chan
Patent |
Priority |
Assignee |
Title |
10379583, |
Apr 19 2017 |
META PLATFORMS TECHNOLOGIES, LLC |
System for discharging heat out of head-mounted display based on hybrid fan and heat pipe |
10656690, |
Apr 19 2017 |
META PLATFORMS TECHNOLOGIES, LLC |
System for discharging heat out of head-mounted display based on hybrid fan and heat pipe |
11029730, |
Apr 19 2017 |
META PLATFORMS TECHNOLOGIES, LLC |
System for discharging heat out of head-mounted display based on hybrid fan |
11435784, |
Apr 19 2017 |
META PLATFORMS TECHNOLOGIES, LLC |
System for discharging heat out of head-mounted display |
D825498, |
Jul 17 2017 |
META PLATFORMS TECHNOLOGIES, LLC |
Heat sink assembly |
D831085, |
Dec 09 2016 |
HITACHI HIGH-TECH CORPORATION |
Substrate processing unit |
D831086, |
Dec 09 2016 |
HITACHI HIGH-TECH CORPORATION |
Substrate processing unit |
D847237, |
Dec 09 2016 |
HITACHI HIGH-TECH CORPORATION |
Substrate processing unit |
D938373, |
Oct 25 2019 |
Applied Materials, Inc |
Substrate transfer structure |
ER7057, |
|
|
|
ER7780, |
|
|
|
Patent |
Priority |
Assignee |
Title |
6132160, |
Jun 27 1997 |
Tokyo Electron Limited |
Substrate transferring apparatus |
6183183, |
Jan 16 1997 |
ADVANCED SEMICONDUCTOR MATERIALS AMERICA, INC |
Dual arm linear hand-off wafer transfer assembly |
6234738, |
Apr 24 1998 |
ASYST JAPAN INC |
Thin substrate transferring apparatus |
6293749, |
Nov 21 1997 |
ASM America, Inc |
Substrate transfer system for semiconductor processing equipment |
6614201, |
Dec 21 2000 |
Tazmo Co., Ltd. |
Substrate transfer system |
6893507, |
Nov 03 1997 |
ASM America, Inc. |
Self-centering wafer support system |
6991419, |
Apr 16 2001 |
Samsung Electronics Co., Ltd. |
Method and apparatus for transferring a wafer |
7186297, |
Dec 15 2000 |
Kabushiki Kaisha Yaskawa Denki |
Wafer holding apparatus |
7578649, |
May 29 2002 |
BROOKS AUTOMATION HOLDING, LLC; Brooks Automation US, LLC |
Dual arm substrate transport apparatus |
D559805, |
Aug 12 2005 |
Tokyo Electron Limited |
Stage arm for a semiconductor wafer delivery apparatus |
D614152, |
Jul 21 2008 |
ASM KOREA LTD |
Substrate transfer device for semiconductor deposition apparatus |
D665759, |
Dec 14 2010 |
Tokyo Electron Limited |
Substrate transfer holder |
D666979, |
Dec 14 2010 |
Tokyo Electron Limited |
Substrate holder |
D695240, |
Oct 20 2011 |
Tokyo Electron Limited |
Arm for wafer transportation for manufacturing semiconductor |
D701498, |
Oct 20 2011 |
Tokyo Electron Limited |
Arm for wafer transportation for manufacturing semiconductor |
KR300554490, |
|
|
|
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a