Patent
   D559805
Priority
Aug 12 2005
Filed
Nov 14 2005
Issued
Jan 15 2008
Expiry
Jan 15 2022
Assg.orig
Entity
unknown
8
16
n/a
The ornamental design for a stage arm for a semiconductor wafer delivery apparatus, as shown and described.

FIG. 1 is a top plan view of a stage arm for a semiconductor wafer delivery apparatus showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a cross-sectional view thereof taken along line 44 in FIG. 1;

FIG. 5 is a cross-sectional view thereof taken along line 55 in FIG. 1; and,

FIG. 6 is a perspective view thereof in use.

The broken line showing represents unclaimed subject matter.

Hosaka, Hiroki

Patent Priority Assignee Title
D589474, Dec 06 2007 Tokyo Electron Limited Wafer holding member
D589912, Jun 06 2007 Tokyo Electron Limited Wafer holding member
D614152, Jul 21 2008 ASM KOREA LTD Substrate transfer device for semiconductor deposition apparatus
D673923, Jan 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D674365, Jan 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D695240, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D701498, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D785578, Mar 22 2016 ASM IP Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 14 2005Tokyo Electron Limited(assignment on the face of the patent)
Jan 18 2006HOSAKA, HIROKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0175260558 pdf
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