Patent
   D614152
Priority
Jul 21 2008
Filed
Jan 16 2009
Issued
Apr 20 2010
Expiry
Apr 20 2024
Assg.orig
Entity
unknown
6
14
n/a
The ornamental design for a substrate transfer device for semiconductor deposition apparatus, as shown and described.

FIG. 1 is a perspective view of a substrate transfer device that may be positioned in a semiconductor deposition apparatus, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The ornamental design which is claimed is shown in solid lines in the drawings.

Lee, Jeong Ho, Jeong, Sang Jin, Choi, Young Seok

Patent Priority Assignee Title
D695240, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D701498, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D785578, Mar 22 2016 ASM IP Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
D938373, Oct 25 2019 Applied Materials, Inc Substrate transfer structure
ER7057,
ER7780,
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 16 2009ASM Genitech Korea, Ltd.(assignment on the face of the patent)
Jan 16 2009LEE, JEONG HOASM Genitech Korea LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0222360249 pdf
Jan 16 2009JEONG, SANG JINASM Genitech Korea LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0222360249 pdf
Jan 16 2009CHOI, YOUNG SEOKASM Genitech Korea LtdASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0222360249 pdf
Oct 10 2016ASM GENITECH KOREA, LTD ASM KOREA LTD CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0486580249 pdf
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