Patent
   D831085
Priority
Dec 09 2016
Filed
Jun 07 2017
Issued
Oct 16 2018
Expiry
Oct 16 2033
Assg.orig
Entity
unknown
0
11
n/a
The ornamental design for a substrate processing unit, as shown and described.

This application contains subject matter related to the following co-pending U.S. design patent applications:

Application Ser. No. 29/606,724, filed herewith and entitled “Substrate Processing Unit”; and

Application Ser. No. 29/606,730, filed herewith and entitled “Substrate Processing Unit”.

FIG. 1 is a front, top and right side perspective view of a substrate processing unit according to the design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another perspective view thereof, shown with an unclaimed cover.

The broken lines in the figures depict unclaimed portions of the substrate processing unit and form no part of the claimed design.

Sakka, Yusaku, Kawasaki, Hiromichi

Patent Priority Assignee Title
Patent Priority Assignee Title
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D581438, Aug 30 2006 LEEMAN TECHNOLOGIES, LLC Hydraulic mechanism
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D785578, Mar 22 2016 ASM IP Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
D804556, Jun 16 2015 KOKUSAI ELECTRIC CORPORATION Heat reflector for substrate processing apparatus
D805044, Oct 30 2015 HIRATA CORPORATION Adhesive sheet for substrate
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JP1456090,
JP1456479,
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Jun 07 2017SAKKA, YUSAKUHitachi High-Technologies CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0433010607 pdf
Jun 07 2017KAWASAKI, HIROMICHIHitachi High-Technologies CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0433010607 pdf
Jun 07 2017Hitachi High-Technologies Corporation(assignment on the face of the patent)
Feb 12 2020Hitachi High-Technologies CorporationHITACHI HIGH-TECH CORPORATIONCHANGE OF NAME AND ADDRESS0522590227 pdf
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