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Patent
   D675172
Priority
Nov 14 2008
Filed
Nov 24 2010
Issued
Jan 29 2013
Expiry
Jan 29 2027
Inventors
Tiner, Rob…
Assg.orig
Applied Ma…
Assg.curr
Applied Ma…
Entity
unknown
Referenced by
8
References
9
Maint.:
n/a
The ornamental design for a substrate support, as shown and described.

FIG. 1 is a top view of the substrate support.

FIG. 2 is a side view of the substrate support.

FIG. 3 is a bottom view of the substrate support.

FIG. 4 is a side view of the substrate support.

FIG. 5 is a detailed view of FIG. 1.

FIG. 6 is a detailed view of FIG. 1.

FIG. 7 is a detailed view of FIG. 1.

FIG. 8 is a detailed view of FIG. 3.

FIG. 9 is a detailed view of FIG. 3.

FIG. 10 is a detailed view of FIG. 3.

FIG. 11 is a detailed view of FIG. 3.

FIG. 12 is a detailed view of FIG. 1.

FIG. 13 is a detailed view of FIG. 3.

FIG. 14 is a detailed view of FIG. 3; and,

FIG. 15 is a detailed view of FIG. 3.

Excepting the details along the perimeter edges of the design in FIGS. 1, 2, and 4, the remainders of the details in FIGS. 1 through 4 are in broken lines as represented in FIGS. 5 through 15, and form no part of the claimed design.
INVENTORS:

Tiner, Robin L.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D701329, Feb 17 2012 Applied Materials, Inc.; Applied Materials, Inc Substrate support
D739349, Feb 12 2013 IDEMITSU KOGYO Co., Ltd. Current plate for insulation washer for power transformer
D758300, Nov 24 2014 THERMO KING LLC Solar panel battery charger for a transport refrigeration unit
D784276, Aug 06 2013 Applied Materials, Inc Susceptor assembly
D831085, Dec 09 2016 HITACHI HIGH-TECH CORPORATION Substrate processing unit
D831086, Dec 09 2016 HITACHI HIGH-TECH CORPORATION Substrate processing unit
D847237, Dec 09 2016 HITACHI HIGH-TECH CORPORATION Substrate processing unit
D864134, Oct 24 2018 ASM IP Holding B.V. Susceptor
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5844205, Apr 19 1996 APPLIED KOMATSU TECHNOLOGY, INC Heated substrate support structure
5846375, Sep 26 1996 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment
6035101, Feb 12 1997 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
6231674, Feb 23 1994 Applied Materials, Inc. Wafer edge deposition elimination
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ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 17 2009TINER, ROBIN L Applied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0260850926 pdf
Nov 24 2010Applied Materials, Inc.(assignment on the face of the patent)
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