FIG. 1 is a top perspective view of a substrate transfer holder showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side view thereof, the right side being a mirror image;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged fragmental view taken along 7-7 of FIG. 5 thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 7 thereof.
The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The alternating long and short dashed lines in the drawings define the boundaries between the claimed and unclaimed features. None of the broken lines form any part of the claim.
The article is a substrate transfer holder for holding and transferring a circular substrate, for example, a semiconductor wafer or the like. Parts indicated by solid lines are the part of article for which a design patent is sought.
Sato, Norifumi
Patent |
Priority |
Assignee |
Title |
D785578, |
Mar 22 2016 |
ASM IP Holding B.V. |
Substrate supporting arm for semiconductor manufacturing apparatus |
D805044, |
Oct 30 2015 |
HIRATA CORPORATION |
Adhesive sheet for substrate |
D811457, |
Nov 02 2015 |
HIRATA CORPORATION |
Substrate conveyance arm |
D812014, |
Jul 30 2015 |
Japan Aviation Electronics Industry, Limited |
Ring for holding the connections of the connectors |
D813283, |
Jun 17 2015 |
THK CO , LTD |
Robot hand |
D868012, |
Jan 18 2017 |
KOKUSAI ELECTRIC CORPORATION |
Cassette receiving tool for semiconductor manufacturing apparatus |
D868013, |
Jan 18 2017 |
KOKUSAI ELECTRIC CORPORATION |
Cassette receiving tool for semiconductor manufacturing apparatus |
D877706, |
Jan 18 2017 |
KOKUSAI ELECTRIC CORPORATION |
Cassette displacement prevention jig of semiconductor manufacturing apparatus |
D938373, |
Oct 25 2019 |
Applied Materials, Inc |
Substrate transfer structure |
//
n/a
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |