Patent
   D868013
Priority
Jan 18 2017
Filed
Jul 17 2017
Issued
Nov 26 2019
Expiry
Nov 26 2034
Assg.orig
Entity
unknown
1
10
n/a
The ornamental design for a cassette receiving tool for semiconductor manufacturing apparatus, as shown and described.

FIG. 1 is a front, top, and left side perspective view of a cassette receiving tool for semiconductor manufacturing apparatus, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2; and,

FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2.

The broken lines shown in the drawings represent portions of the cassette receiving tool for semiconductor manufacturing apparatus that form no part of the claimed design.

Karasawa, Tadayoshi

Patent Priority Assignee Title
D956705, Nov 07 2019 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
Patent Priority Assignee Title
5947675, Nov 13 1996 Tokyo Electron Limited Cassette transfer mechanism
5947677, Nov 20 1996 Tokyo Electron Limited Cassette transfer mechanism
6152680, Aug 26 1997 DAITRON, INC Wafer cassette rotation mechanism
6270307, Jan 25 1999 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
6595841, Dec 20 2001 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process
8676375, Feb 27 2012 Veeco Instruments INC Automated cassette-to-cassette substrate handling system
D665759, Dec 14 2010 Tokyo Electron Limited Substrate transfer holder
D674365, Jan 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D695240, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
D701498, Oct 20 2011 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
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Jul 03 2017KARASAWA, TADAYOSHIHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0430220240 pdf
Jul 17 2017KOKUSAI ELECTRIC CORPORATION(assignment on the face of the patent)
Sep 19 2018Hitachi Kokusai Electric IncKOKUSAI ELECTRIC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0469260886 pdf
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