Patent
   D911987
Priority
Mar 15 2019
Filed
Sep 05 2019
Issued
Mar 02 2021
Expiry
Mar 02 2036
Assg.orig
Entity
unknown
1
20
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a perspective view of a semiconductor element showing our new design;

FIG. 2 is a front view of the semiconductor element of FIG. 1;

FIG. 3 is a rear view of the semiconductor element of FIG. 1;

FIG. 4 is a left side view of the semiconductor element of FIG. 1;

FIG. 5 is a right side view of the semiconductor element of FIG. 1;

FIG. 6 is a top view of the semiconductor element of FIG. 1; and,

FIG. 7 is a bottom view of the semiconductor element of FIG. 1.

The broken line portions of the semiconductor element in FIGS. 1-7 form no part of the claimed design.

Aoki, Hirotoshi, Yoshida, Kiyotaka, Yoshino, Tomohiko

Patent Priority Assignee Title
D923591, Mar 15 2019 TAMURA CORPORATION Semiconductor driving circuit module
Patent Priority Assignee Title
5347160, Sep 28 1992 Sundstrand Corporation Power semiconductor integrated circuit package
6268650, May 25 1999 Round Rock Research, LLC Semiconductor device, ball grid array connection system, and method of making
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
6774465, Oct 05 2001 Semiconductor Components Industries, LLC Semiconductor power package module
20010038143,
20020064901,
20110044012,
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
D401567, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D522470, Sep 09 2004 Kioxia Corporation Portion of a semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D774479, Nov 28 2014 Fuji Electric Co., Ltd. Semiconductor module
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D864884, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
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Aug 20 2019AOKI, HIROTOSHITAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503340246 pdf
Aug 20 2019YOSHINO, TOMOHIKOTAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503340246 pdf
Aug 21 2019YOSHIDA, KIYOTAKATAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503340246 pdf
Sep 05 2019TAMURA CORPORATION(assignment on the face of the patent)
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