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Patent
D911987
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Priority
Mar 15 2019
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Filed
Sep 05 2019
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Issued
Mar 02 2021
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Expiry
Mar 02 2036
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Assg.orig
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Entity
unknown
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1
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20
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n/a
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The ornamental design for a semiconductor element, as shown and described.
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FIG. 1 is a perspective view of a semiconductor element showing our new design;
FIG. 2 is a front view of the semiconductor element of FIG. 1;
FIG. 3 is a rear view of the semiconductor element of FIG. 1;
FIG. 4 is a left side view of the semiconductor element of FIG. 1;
FIG. 5 is a right side view of the semiconductor element of FIG. 1;
FIG. 6 is a top view of the semiconductor element of FIG. 1; and,
FIG. 7 is a bottom view of the semiconductor element of FIG. 1.
The broken line portions of the semiconductor element in FIGS. 1-7 form no part of the claimed design.
Aoki, Hirotoshi, Yoshida, Kiyotaka, Yoshino, Tomohiko
| Patent |
Priority |
Assignee |
Title |
| 5347160, |
Sep 28 1992 |
Sundstrand Corporation |
Power semiconductor integrated circuit package |
| 6268650, |
May 25 1999 |
Round Rock Research, LLC |
Semiconductor device, ball grid array connection system, and method of making |
| 6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
| 6774465, |
Oct 05 2001 |
Semiconductor Components Industries, LLC |
Semiconductor power package module |
| 20010038143, |
|
|
|
| 20020064901, |
|
|
|
| 20110044012, |
|
|
|
| D317592, |
Jan 19 1987 |
Canon Kabushiki Kaisha |
Semiconductor element |
| D401567, |
Apr 25 1997 |
Micron Technology, Inc. |
Temporary package for semiconductor dice |
| D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
| D522470, |
Sep 09 2004 |
Kioxia Corporation |
Portion of a semiconductor device |
| D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
| D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
| D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
| D748595, |
Feb 03 2015 |
Infineon Technologies AG |
Power semiconductor module |
| D766851, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D773412, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
| D774479, |
Nov 28 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
| D799439, |
May 31 2016 |
Rohm Co., Ltd. |
Power converting semiconductor module |
| D864884, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a