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Patent
   D401567
Priority
Apr 25 1997
Filed
Apr 25 1997
Issued
Nov 24 1998
Expiry
Nov 24 2012
Inventors
Farnworth,…
Assg.orig
Micron Tec…
Assg.curr
Micron Tec…
Entity
unknown
Referenced by
18
References
14
Maint.:
n/a
The ornamental design for a temporary package for testing semiconductor dice, as shown and described.

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.
INVENTORS:

Farnworth, Warren M., Wood, Alan G., Akram, Salman, Hembree, David R.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
6025728, Apr 25 1997 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor package with wire bond protective member
6222379, Jun 04 1991 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
6242931, May 03 1999 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Flexible semiconductor interconnect fabricated by backside thinning
6255840, Apr 25 1997 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor package with wire bond protective member
6263566, May 03 1999 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Flexible semiconductor interconnect fabricated by backslide thinning
6300782, May 03 1999 Micron Technology, Inc. System for testing semiconductor components having flexible interconnect
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D459705, Mar 06 2001 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
D466485, May 23 2001 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
D507248, Jul 27 2004 Yamaichi Electronics Co., Ltd. Semiconductor carrier
D507545, Feb 20 2004 Yamaichi Electronics Co., Ltd. Semiconductor carrier
D516046, Feb 20 2004 Yamaichi Electronics Co. Base for a semiconductor carrier
D516528, Feb 20 2004 Yamaichi Electronics Co., Ltd. Cover for a semiconductor carrier
D518798, Jul 27 2004 Yamaichi Electronics Co., Ltd Cover for a semiconductor carrier
D525215, Jan 27 2004 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
D904991, Mar 15 2019 TAMURA CORPORATION Semiconductor element
D911987, Mar 15 2019 TAMURA CORPORATION Semiconductor element
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5173451, Nov 05 1991 Round Rock Research, LLC Soft bond for semiconductor dies
5302891, Jun 04 1991 Micron Technology, Inc. Discrete die burn-in for non-packaged die
5408190, Jun 04 1991 Micron Technology, Inc. Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die
5440240, Jun 04 1991 Micron Technology, Inc.; MICRON TECHNOLOGY, INC , A CORPORATION OF DELAWARE Z-axis interconnect for discrete die burn-in for nonpackaged die
5451165, Jul 27 1994 Minnesota Mining and Manufacturing Company Temporary package for bare die test and burn-in
5495179, Jun 04 1991 Micron Technology, Inc.; Micron Technology, Inc Carrier having interchangeable substrate used for testing of semiconductor dies
5517125, Jul 09 1993 AEHR TEST SYSTEMS, INC Reusable die carrier for burn-in and burn-in process
5519332, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
5530376, Nov 05 1993 Sunright Limited Reusable carrier for burn-in/testing of non packaged die
5541525, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
5543725, Aug 25 1993 SUNRIGHT LIMITTED Reusable carrier for burn-in/testing on non packaged die
5581195, Nov 20 1993 SAMSUNG ELECTRONICS CO , LTD Semiconductor chip holding device
5742169, Feb 20 1996 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
D394844, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 18 1997FARNWORTH, WARREN M Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085290898 pdf
Apr 18 1997AKRAM, SALMANMicron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085290898 pdf
Apr 21 1997WOOD, ALAN G Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085290898 pdf
Apr 21 1997HEMBREE, DAVID R Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085290898 pdf
Apr 25 1997Micron Technology, Inc.(assignment on the face of the patent)
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