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Patent
   D394844
Priority
Apr 25 1997
Filed
Apr 25 1997
Issued
Jun 02 1998
Expiry
Jun 02 2012
Inventors
Farnworth,…
Assg.orig
Micron Tec…
Assg.curr
Micron Tec…
Entity
unknown
Referenced by
79
References
20
Maint.:
n/a
The ornamental design for a temporary package for semiconductor dice, as shown and described.

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.
INVENTORS:

Farnworth, Warren M., Wood, Alan G., Akram, Salman, Hembree, David R.

THIS PATENT IS REFERENCED BY THESE PATENTS:
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THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
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ASSIGNMENT RECORDS    Assignment records on the USPTO
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 18 1997FARNWORTH, WARREN M Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085380848 pdf
Apr 18 1997AKRAM, SALMANMicron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085380848 pdf
Apr 21 1997WOOD, ALAN G Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085380848 pdf
Apr 21 1997HEMBREE, DAVID R Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0085380848 pdf
Apr 25 1997Micron Technology, Inc.(assignment on the face of the patent)
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