Patent
   D507545
Priority
Feb 20 2004
Filed
Aug 18 2004
Issued
Jul 19 2005
Expiry
Jul 19 2019
Assg.orig
Entity
unknown
2
7
n/a
The ornamental design for the semiconductor carrier, as shown and described.

FIG. 1 is a front view of a semiconductor carrier showing our new design, the back view being a mirror image thereof;

FIG. 2 is a top view of our new design;

FIG. 3 is a bottom view of our new design;

FIG. 4 is a right-side view of our new design;

FIG. 5 is a left-side view of our new design; and,

FIG. 6 is a left-front perspective view of our new design.

Nakamura, Yuji, Suzuki, Katsumi, Ishibashi, Takahiro, Kobori, Eiji

Patent Priority Assignee Title
D694724, Oct 03 2012 HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD Semiconductor device
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
Patent Priority Assignee Title
5451165, Jul 27 1994 Minnesota Mining and Manufacturing Company Temporary package for bare die test and burn-in
5519332, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
5541525, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
20010043074,
20040016993,
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D401567, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 10 2004SUZUKI, KATSUMIYAMAICHI ELECTRONICS CO LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157060943 pdf
Aug 10 2004KOBORI, EIJIYAMAICHI ELECTRONICS CO LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157060943 pdf
Aug 11 2004NAKAMURA, YIJIYAMAICHI ELECTRONICS CO LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157060943 pdf
Aug 12 2004ISHIBASHI, TAKAHIROYAMAICHI ELECTRONICS CO LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157060943 pdf
Aug 18 2004Yamaichi Electronics Co., Ltd.(assignment on the face of the patent)
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