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The ornamental design for the semiconductor carrier, as shown and described.
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FIG. 1 is a front view of a semiconductor carrier showing our new design, the back view being a mirror image thereof;
FIG. 2 is a top view of our new design;
FIG. 3 is a bottom view of our new design;
FIG. 4 is a right-side view of our new design;
FIG. 5 is a left-side view of our new design; and,
FIG. 6 is a left-front perspective view of our new design.
Nakamura, Yuji, Suzuki, Katsumi, Ishibashi, Takahiro, Kobori, Eiji
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 10 2004 | SUZUKI, KATSUMI | YAMAICHI ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015706 | /0943 | |
Aug 10 2004 | KOBORI, EIJI | YAMAICHI ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015706 | /0943 | |
Aug 11 2004 | NAKAMURA, YIJI | YAMAICHI ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015706 | /0943 | |
Aug 12 2004 | ISHIBASHI, TAKAHIRO | YAMAICHI ELECTRONICS CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015706 | /0943 | |
Aug 18 2004 | Yamaichi Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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