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The ornamental design for a cover for a semiconductor carrier, as shown and described.
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FIG. 1 is a left, front perspective view of a cover for a semiconductor carrier showing our new design;
FIG. 2 is a front view of our new design, the rear view being a mirror image thereof;
FIG. 3 is a right-side view of our new design, the left-side view being a mirror image thereof;
FIG. 4 is a top view of our new design; and,
FIG. 5 is a bottom view of our new design.
The broken lines are for illustrative purposes only and form no part of the claimed design.
Nakamura, Yuji, Suzuki, Katsumi, Ishibashi, Takahiro, Kobori, Eiji
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 10 2005 | Yamaichi Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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