Patent
   D507248
Priority
Jul 27 2004
Filed
Jul 27 2004
Issued
Jul 12 2005
Expiry
Jul 12 2019
Assg.orig
Entity
unknown
3
7
n/a
The ornamental design for a semiconductor carrier, as shown and described.

FIG. 1 is a top plan view of a semiconductor carrier of our new design in its entirety;

FIG. 2 is a bottom plan view of our new design;

FIG. 3 is a right end view of our new design;

FIG. 4 is a left end view of our new design;

FIG. 5 is a front view of our new design;

FIG. 6 is a rear view our new design; and,

FIG. 7 is a left, front perspective view of our new design.

Matsuoka, Noriyuki, Hisaishi, Minoru, Suzuki, Takeyuki

Patent Priority Assignee Title
D539275, Aug 12 2005 Mitsumi Electric Co., Ltd. Wireless module
D694724, Oct 03 2012 HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD Semiconductor device
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
Patent Priority Assignee Title
5451165, Jul 27 1994 Minnesota Mining and Manufacturing Company Temporary package for bare die test and burn-in
5519332, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
5541525, Jun 04 1991 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
20010043074,
20040016993,
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D401567, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 26 2004HISAISHI, MINORUYAMAICHI ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156280993 pdf
Jul 26 2004MATSUOKA, NORIYUKIYAMAICHI ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156280993 pdf
Jul 26 2004SUZUKI, TAKEYUKIYAMAICHI ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156280993 pdf
Jul 27 2004Yamaichi Electronics Co., Ltd.(assignment on the face of the patent)
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