|
The ornamental design for a semiconductor carrier, as shown and described.
|
FIG. 1 is a top plan view of a semiconductor carrier of our new design in its entirety;
FIG. 2 is a bottom plan view of our new design;
FIG. 3 is a right end view of our new design;
FIG. 4 is a left end view of our new design;
FIG. 5 is a front view of our new design;
FIG. 6 is a rear view our new design; and,
FIG. 7 is a left, front perspective view of our new design.
Matsuoka, Noriyuki, Hisaishi, Minoru, Suzuki, Takeyuki
Patent | Priority | Assignee | Title |
D539275, | Aug 12 2005 | Mitsumi Electric Co., Ltd. | Wireless module |
D694724, | Oct 03 2012 | HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD | Semiconductor device |
D699693, | Oct 03 2012 | FUJI ELECTRIC CO , LTD | Semiconductor device |
Patent | Priority | Assignee | Title |
5451165, | Jul 27 1994 | Minnesota Mining and Manufacturing Company | Temporary package for bare die test and burn-in |
5519332, | Jun 04 1991 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
5541525, | Jun 04 1991 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
20010043074, | |||
20040016993, | |||
D359028, | Sep 02 1993 | SGS-Thomson Microelectronics, Inc | Socketed integrated circuit package |
D401567, | Apr 25 1997 | Micron Technology, Inc. | Temporary package for semiconductor dice |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 26 2004 | HISAISHI, MINORU | YAMAICHI ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015628 | /0993 | |
Jul 26 2004 | MATSUOKA, NORIYUKI | YAMAICHI ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015628 | /0993 | |
Jul 26 2004 | SUZUKI, TAKEYUKI | YAMAICHI ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015628 | /0993 | |
Jul 27 2004 | Yamaichi Electronics Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |