Base for a semiconductor carrier

The ornamental design for a base for a semiconductor carrier, as shown and described.

FIG. 1 is a front view of a base for a semiconductor carrier showing our new design, the rear view being a mirror image thereof;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof, the perforations shown in dashed lines being no part of the claimed design;

FIG. 4 is a right-side view thereof;

FIG. 5 is a left-side view thereof; and,

FIG. 6 is a perspective view thereof.

Patent

Priority

Assignee

Title

Patent	Priority	Assignee	Title
5451165,	Jul 27 1994	Minnesota Mining and Manufacturing Company	Temporary package for bare die test and burn-in
5519332,	Jun 04 1991	Micron Technology, Inc.	Carrier for testing an unpackaged semiconductor die
5541525,	Jun 04 1991	Micron Technology, Inc.	Carrier for testing an unpackaged semiconductor die
20010043074,
20040016993,
D359028,	Sep 02 1993	SGS-Thomson Microelectronics, Inc	Socketed integrated circuit package
D401567,	Apr 25 1997	Micron Technology, Inc.	Temporary package for semiconductor dice

Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
May 10 2005		Yamaichi Electronics Co.	(assignment on the face of the patent)

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